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5050RGB全彩內置IC

5050RGB內置IC幻彩燈珠?HKA5812全彩LED內置IC?5050內置IC智能RGB七彩LED

1.  產品特性:(Features)

垂直型表貼P4腳位封裝vertical table stick P4 feet a package

防潮等級:2aMoisture proof level: 2a:    

5.0*5.0*0.7高 : (L)5.0  *( W)5.0 * (H)0.7

寬發光角度:2θ1/2=120: Wide light Angle: 2 1/2 = 120 theta

包裝:1000/卷: Packaging: 1000 / volume:

內部集成高質量串行級聯恒流IC:

Internal serial cascade constant current IC integrated quality

三路恒流驅動:Three-way constant current driver


2.  應用:(Applications )                                 

?  LED全彩模組LED full-color module

?  LED全彩發光字燈串 LED full-color module                                           

?  LED幻彩軟硬燈條:LED super soft article lamp

?  LED護欄管:LED guardrail tube

?  LED點光源,LED像素屏:LED light source, LED pixel screen

?  LED異形屏:LED abnormity screen

?  LED跑馬燈條:LED running lights

?  汽車輔助照明:car auxiliary lighting:

?  其他適合的應用: other suitable applications


3.  尺寸圖 (Outline Dimensions)


封裝尺寸:Package Dimensions

                                             


建議焊盤尺寸圖

          

 

 備注:(Notes:)

                 *所有標注尺寸單位為毫米: All dimension units are millimeters.

                 *除特別標注外,所有尺寸允許公差±0.1mm : All dimension tolerance is ±0.1mm unless otherwise not.

 

4.  產品對應管腳功能說明

 

5.  電氣參數(極限參數,Ta=25℃,VSS=0V)

 

6.  電氣參數(Ta=25℃,Ta=-20~VSS=0V)

 

7.  動態參數:(Ta=25℃)

 

典型應用電路:()

 

8.  光電參數(溫度=25℃):(Electrical-Optical Characteristics)


           備注[Note]:

             *光通量(LM)±10%  Luminous intensity(LM) 10%

             *正向電壓±0.05             Forward Voltage (VF)0.05V


9.信賴性測試項目及標準:Test items and results of reliability


10.失效判斷標準:Criteria for judging the Damage

 

      備注:[Note]:*USL:標準上限值U.S.L: Upper standard level     *LSL:標準下限值  Lower Specification Level

 

11.回流焊接曲線圖:IR reflow soldering Profile

 

注意:NOTES

        ?  我們建議的回流焊溫度為240℃±5℃,最高的焊接溫度要控制在260℃以內。

     We reeommend the reflow temperature 240℃±5.the maximum soldering temperature should be limited to 260°

        ?  當產品在處在高溫狀態中時不要對其硅膠施加壓力。

     Don’t cause stress to the silicone resin while it is exposed to high temperature.

        ?  回流焊的次數應小于兩次。

     Number of reflow process shall be 1 time.

        ?  燈珠不要焊接在彎曲的PCB板上,焊接之后,也不要彎折線路板。

     Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp the circuit board.LED

        ?  回流焊之后冷卻過程中,不要對材料實加外力,也不要有震動,回流焊后,不要采用激劇冷卻的方式。

     Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering.Do not rapidly cool device after soldering.

        ?  LED工作環境及與LED適配的材料中硫元素及化合物成份不可超過100PPM

     LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material.

        ?  當我們需要使用外封膠涂抹LED產品時,應確保外封膠與LED封裝膠水相匹配,因為大多數LED的封裝膠水為硅膠,它有較 強的氧化性和較強的吸濕性,必須防止外封材質進入LED內部以造成LED的損傷,單一的溴元素含量要求小于900PPM,單 一氯元素含量要求小于900PPM,在涂抹LED產品時要求外封膠溴元素與氯元素總含量必須小于1500PPM

     When we need to use external glue for LED application products, please make sure that the external glue matches the LED packaging glue. Additionally ,as most of LED packaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of Chlorine element is required to be less than 900PPM,the total content of Bromine element and Chlorine element in the external glue of the application products is required to be less than 1500PPM.

 

12.包裝規格 :Packing specification                          

 ?  標簽:(Label): /

 ?  載帶規格(單位:mm):Tape Specifications (Units : mm)


?  卷軸尺寸:Reel Dimensions

                                                   


?  防潮帶包裝:(Moisture Resistant Packaging )       

  注:標注公差為±0.1mm ,單位:mm :(Note: The tolerances unless mentioned is ±0.1mm , Unit: mm

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